| Item |
Capability |
| PCB Layers |
1-18 Layers |
| Base Material |
FR4,CEM1,CEM3,Aluminum,Polymide, Rogers,Teflon |
| Copper Thickness |
0.5-6 OZ |
| Impedance Control |
Yes |
| Peeable Mask |
Yes |
| Min.Line Width |
0.08mm |
| Min.Line Spacing |
0.08mm |
| Min.Annual Ring PTH |
0.15mm |
| Min.PTH |
0.20mm±0.05mm |
| Non-PTH |
0.15mm±0.05mm |
| Hole Aspect Ratio |
10 |
| Min.Board Thickness |
1-2layer:0.2mm |
| Multilayer(4,6,8,10 layer)0.4mm,0.55mm,0.8mm,0,8mm |
| Max Board Sixe |
600*900mm,400*1200mm |
| Solder Mask Pitch |
0.1mm |
| Outline Tolerance |
±0.15mm |
| V-CUT Tolerance |
±0.10mm |
| thickness Tolerance |
±0.10mm |
| Gold Finger |
5u"-50u" |
| Surface Finish |
HASL,LF HAL,Immersion Gold,Immersion silver, Flash Gold,Flux Coat&OSP |
| Special Capability |
Burial/blind vias,Impedance Control,via plug, BGA,Gold Finger |
| Test |
Flying probe test,E-test,Inspection AOI test |
| Certificate |
RoHS,ISO9001:2000,IATF16949:2016,SGS,UL |
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