manufacturing capability

 ItemCapability
PCB Layers1-18 Layers
Base MaterialFR4,CEM1,CEM3,Aluminum,Polymide, Rogers,Teflon
Copper Thickness0.5-6 OZ
Impedance ControlYes
Peeable MaskYes
Min.Line Width0.08mm
Min.Line Spacing0.08mm
Min.Annual Ring PTH0.15mm
PTH0.20mm±0.05mm
Non-PTH0.15mm±0.05mm
Hole Aspect Ratio10
Min.Board Thickness1-2layer:0.2mm
Multilayer(4,6,8,10 layer)0.4mm,0.55mm,0.8mm,0,8mm
Max Board Sixe600*900mm,400*1200mm
Solder Mask Pitch0.1mm
Outline Tolerance±0.15mm
V-CUT Tolerance±0.10mm
thickness Tolerance±0.10mm
Gold Finger5u"-50u"
Surface FinishHASL,LF HAL,Immersion Gold,Immersion silver,  Flash Gold,Flux Coat&OSP
Special CapabilityBurial/blind vias,Impedance Control,via plug, BGA,Gold Finger
TestFlying probe test,E-test,Inspection AOI test
CertificateRoHS,ISO9001:2000,ISO14001:2004,SGS,UL
                                                                                                                                                         
China Professional PCB Manufacturer - Multech Electornic Limited

Service

  • 1/2 Layer PCB
  • Multilayer PCB
  • Quick-turn PCB
  • PCB Stencil
  • PCB Assembly

B318-319, Taoyuan commercial building, Xixiang, Bao'an District,

Shenzhen,518126,Guangdong Province,P.R of China

Tel: 86-0755-27821591 / 27821592 

Email: info@mul-tech.com

Copy Right(c) Multech Electronic Limited

http://www.mul-tech.com

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